《化合物半导体加工中的表征(英文)》的主要内容包括： Preface to the Reissue of the Materials Characterization Series ix；Preface to Series x；Preface to the Reissue of Characterization of CompoundSemiconductor Processing xi；Preface xiii；Contributors xv等。

Preface to the Reissue of the Materials Characterization Series ix 
Preface to Series x 
Preface to the Reissue of Characterization of Compound 
Semiconductor Processing xi 
Preface xiii 
Contributors xv 
CHARACTERIZATION OF III—V THIN FILMS FOR 
ELECTRONIC DEVICES 
III—V COMPOUND SEMICONDUCTOR FILMS FOR 
OPTICAL APPLICATIONS 
CONTACTS 
DIELECTRIC INSULATING LAYERS 
OTHER COMPOUND SEMICONDUCTOR FILMS 
DEEP LEVEL TRANSIENT SPECTROSCOPY： A CASE STUDY 
ON GaAs 
APPENDIX： TECHNIQUE SUMMARIES